
MPC7448 RISC Microprocessor Hardware Specifications, Rev. 4
24 Freescale Semiconductor
Pin Assignments
6 Pin Assignments
Figure 12 (in Part A) shows the pinout of the MPC7448, 360 high coefficient of thermal expansion ceramic
ball grid array (HCTE) package as viewed from the top surface. Part B shows the side profile of the HCTE
package to indicate the direction of the top surface view.
Figure 12. Pinout of the MPC7448, 360 HCTE Package as Viewed from the Top Surface
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
12 3 4 5678 910111213141516
Not to Scale
17 18 19
U
V
W
Part A
View
Part B
Die
Substrate Assembly
Encapsulant
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